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Chip Manufacturing Process
The chip manufacturing process can be divided into Wafer Fabrication, Wafer Probe, Packaging, Initial Test and Final Test. The wafer processing and wafer needle testing processes are Front End processes, while the assembly and testing processes are Back End processes.
42015-2 -
Analysis of Several Problems of Sudden Chip Drop
The number of chip sheets is in conflict with powder box and carbon powder, including whether the motherboard of the machine is in conflict with the serial number of the chip, and the state of the machine at the time of installation has a certain correlation. For example, in the case of standard printing 2500 sheets to print 5% test manuscripts, printing one sheet will display and print one sheet, if printing a completely black test sheet.
42015-2 -
Why is the powder silo of the regenerated color laser printer easy to leak
The structure of color laser printer carbon powder is very different from that of black carbon powder. The process of making Aftermarket color carbon powder is mainly chemical synthesis, and the additive of color part is extracted from chemical dyes, so it has strong corrosiveness. This is why the scrapers in the color powder bin are metal, not the resin scrapers we often see. After a period of use, the magnetic rollers and scrapers of the powder silo are corroded to a certain extent, resulting in the carbon powder on the magnetic roll can not be completely cleaned and scattered in the printer. This phenomenon will also have similar problems even in the powder silo of OEM.
On the other hand, if the regenerated color powder bin does not follow the correct method, it also becomes a cause of powder leakage. Therefore, the correct regeneration method and timely replacement of relevant accessories can completely solve the above problems.42015-2 -
Comprehensive Detection and Identification of Carbon Powder Quality
To determine the comprehensive quality of a model, the following six factors should be considered: blackness, bottom ash, waste powder rate, fixity and ghost. These factors are interrelated and influence each other. The reasons that affect these factors are discussed below.
42015-2 -
How to submit Bug or Functional Requirements to Apple?
Submitting Radar may encounter a situation where someone has submitted this question before, so it will be labeled "duplicate" and don't panic. In fact, there is a technique for submitting Radar.
42015-2 -
Simple Installation Instructions for Samsung 4300 Chip Driver
1. Install 4300 compatible chip on 4300 selenium drum filled with powder.
2. Before installing the 4300 chip driver, make sure that the 4300 printer random attached to the 4300 printer driver has been installed on the computer.42015-2 -
How to Use Laser Printing Consumables Correctly
Poor quality carbon powder, in the humid and temperature changing environment, a little longer shelf time, will produce caking phenomenon, the use process will damage the parts of carbon powder box, thus affecting the imaging quality, and will shorten the service life of carbon powder box.
42015-2 -
Suggestions and Measures for HP Firmware Upgrade
I just learned recently that HP secretly upgraded LaserJet laser firmware worldwide in early October 2011! This firmware upgrade gives specific models of HP LaserJet lasers and their multi-functional integrated machines the ability to connect to the cloud, as well as the latest mobile printing capabilities, including HP ePrint (wireless connection printing) and AIR Print (cloud printing). This series of firmware upgrades can, to a certain extent, limit the use of compatible consumables with chips, and make some of the latest machines unrecognizable and work! Especially for: HP435/436/285/278/388 universal chip, HP285A and HP278A are incompatible, the situation of non-recognition occurs, temporarily excluding HP435/436/388!
42015-2